The 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) conference was jointly organized by the Center of Reliable Power Electronics (CORPE) and Department of Energy Technology, Aalborg University, Denmark. It was held at Aalborg Congress & Cultural Center, Aalborg, Denmark during the October 1st to 5th, 2018.
There are 415 participants from 43 countries, out of which 268 Delegates, 103 students, and 40 exhibitor staff. The conference received more than 350 technical papers. ESREF allowed electronic reliability professionals and failure analysis professionals to meet annually and participate in a rewarding exchange of experience, technical knowledge, and valuable industry connections. I meet many delegates, and research expertise in my research area, discussed new challenges, and hopefully find solutions or good hints to solve the new problems I encounter in our daily research.
The schedule of the conference is as follows:
1) Participated in the Tutorial-1, 3 and 5: Reliability of Sic and Gan Power Devices from the Industrial Perspective by Thomas Detzel and Thomas Aichinger from Infineon Technologies, Austria AG. Reliability of Packages for Power Devices by Andreas Middendorf, Olaf Wittler Fraunhofer Institute for Reliability and Microintegration IZM, Berlin. Introduction to the modern reliability based on physics and statistics by Peter de Rimmen, Reliability advisor, Danfoss Power Electronics A/S.
2) Attended to the session ‘system-level reliability and condition monitoring of photovoltaic and wind systems’, the author seed peyghami explained about the System-level reliability enhancement of dc/dc stage of a single-phase PV inverter. Also attended to the session ‘System Application reliability, the author explained about the Lifetime extension through Tj equalisation by use of intelligent gate driver with multi-chip power module
3) Attended the Young professional reception, there I met many young scholars and professors
Attended to the sessions, gained the knowledge about the Failure modes and mechanism analysis of SiC MOSFET under short-circuit conditions, Method of junction temperature estimation and over temperature protection used for electric vehicle’s IGBT power modules.
I have presented my research work there, I met many professors and researchers from Industries, gained the knowledge from them.
Gatla Ranjith kumar